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Jin Yuankang vacuum sputtering, usually refers to the magnetron sputtering, belongs to the high speed low temperature sputtering method. The process of vacuum around 1 * 10-3Torr, 1.3 * 10-3Pa vacuum argon filled with inert gas (Ar), and the plastic substrate (anode) and metal material (cathode) between the plus due to high voltage DC glow discharge (glow, discharge) electron excitation produced by inert gas, plasma, plasma metal target atomic bomb, deposited on the plastic substrate. Compared with the commonly used sputtering deposition, sputtering and plating adhesion with substrate of strong adhesion than the high evaporation. More than 10 times, the advantages of uniform plating density. The vacuum evaporation need to make metal or metal oxide is vaporized, and the heating temperature is not too high, otherwise, the metal deposited on plastic substrate and exothermic gas Burn the plastic substrate. Several sputtered particles are not affected by gravity, the target and the substrate position can be freely arranged, film forming the initial nucleation density is high, the production of thin continuous film 10nm below the target, long service life, long time continuous production automation.